We provide FREE testing with all orders
MLC Europe GmbH provides ISO Testing services through our 3rd party certified testing laboratory partners at no extra cost. We can offer certified visual and electrical testing reports to verify that the functionality and qualities of the devices you order are in accordance with specification.
All sectors within the obsolete electronic component industry need to ensure that each inspector is trained with the unique techniques and attributes to detect counterfeit parts, due to the increasing number of counterfeit components on the market. Conventional inspection techniques for electronic components do not incorporate the tests needed to identify suspect counterfeit parts. We work with only well-known and highly reliable electronic component testing laboratories who have years of experience in electronic inspection. This allows us to be confident when offering guarantees and aids us in evaluating our vendors. We often perform spot checks with vendors to ensure they consistently provide excellent quality products.
Visual and Electrical tests are performed free of cost to all customers, and we perform various additional tests and inspections when necessary.
All processes are performed by a Components Test Laboratory which is certified as ISO 9001:2008 and as an AS9100-C complaint organisation as well.
We can meet your testing needs for most types of electronic components and simulate a test environment based on your needs. Below is a list of common tests which we often undertake, if necessary. Other device specific tests can be provided upon request.
Incoming Documentation and Packaging Inspection
This inspection verifies the box damages, ESD protection, type of package, humidity indicator card (HIC) pass H2O test, etc. This testing is non-destructive and performed in accordance with SAE AS6081, 18.104.22.168.1.
External Visual Inspection
This inspection verifies the characteristics of electronic parts to evaluate quality and originality. This includes inceptions such as the condition of the components, part markings, evidence of a secondary coating, lead conditions, dimensions and surface quality. Visual inspection is non-destructive and performed per SAE AS6081 and MIL-STD-883 Method 2009.9 and on a sample of parts from a given lot base on the sample according to the ANSI ASQE Z1.4 Table II−A.
Common things generally looked for during a visual inspection test of an Integrated Circuit device include:
- Package condition and dimension of the product
- Device markings and signs of remarking
- Body inspection to identify scratches, cracks, corrosion, contamination, markings, coatings, etc.
- Pin indicator orientation, texture, coating, dimensions
- Lead condition (oxidation, alignment, exposure, corrosion, etc.)
- BGA inspection for broken, damaged or displaced BGA’s
- Substrate condition
AC/DC Electrical Function Testing
Electronic Tests will verify electrical operating conditions of active and passive components on various types of components from limited DC function to full DC/AC function. This is performed in accordance with MIL-STD-883 and manufacturer’s specifications. We can simulate test conditions depending on industry compliance requirements (i.e., Military, Automotive, Medical, etc.).
Electrical testing is helpful to:
- evaluate input and output characteristics of electronic components
- compare known “good” devices with unknown devices to provide some level of examination
- detect failure analysis
The solderability of a substrate is a measure of the ease with which a soldered joint can be made to that material. It determines if the electric component will have soldering issue at the contract manufacturer. This destructive test is performed per MIL-STD-883 Method 203.8 and J-STD-002.
Decapsulation Internal Analysis
Decapsulation tests can be provided for customers to ensure that the original manufacturer has produced the device. This destructive test will expose the die, and characteristics such as die markings, metallization damage due to ESD or corrosion will be verified. Decapsulation is usually performed on 1 sample per lot / date code base on MIL-STD-883, Method 2014 or AS6081, 22.214.171.124.6.
A decapsulation test exposes the internal structure of the device by removing the exterior of the device. This is often achieved using an acid mixture to expose the bonding wires, internal structure, and the die.
X-ray inspections are non-destructive tests to verify the bond wire connections, die size comparison and ESD damaged. X-Ray are performed base on AS6081 126.96.36.199.4 and MIL-STD-883 2012.7. Counterfeit devices can be determined by comparing the structure of the die to a known good device, while the test also analyses:
- Broken or Missing Bond Wires
- Wire Bonding Options
- Void Analysis
- Check for De-lamination
- Structure Analysis
- Die Size Comparison